Toshiba, NEC Electronics Expand IBM Partnership to 28nm Chip Technology
June 20, 2009
Building on their previous 32nm HKMG (High-K Metal
Gate) technology alliance with IBM, Japan's Toshiba and NEC Electronics have
expanded their partnership with IBM to the development of next-generation 28nm
HKMG low-power chip process technology, Kyodo News reported on June 18. Via the
alliance based in East Fishkill, New York, Toshiba and NEC Electronics will
pitch in to develop a 28-nm bulk CMOS (Complementary Metal Oxide Semiconductor)
process technology, which is expected to make for faster processing and longer
battery life in mobile phones and other consumer electronics products. Toshiba
joined the IBM-led alliance in December 2007 and NEC Electronics in September
2008. Current members of the alliance include Chartered Semiconductor
Manufacturing, GlobalFoundries, Infineon Technologies, Samsung Electronics, and
STMicroelectronics. Toshiba expects to begin mass production of 28nm chips in
fiscal 2010, which runs from April 2010 through March 2011, according to the
Kyodo News report.